SMDDT-0603 Low 系列


SMDDT-0603 Low 系列

Features

▶Ultra low resistance

▶RoHS compliant and lead-free

▶Halogen-free

▶Fast response to fault current

▶Symmetrical design

Applications

▶USB port protection - USB 2.0, 3.0&OTG

▶Li-ion/Li-Polymer battery packs

▶PDAs / digital cameras

▶Computer periperals

▶PC motherboards-plug and play protection

HF   RoHS   REACH   Pb Free 产品规格书
Electrical Characteristics 
Model I-hold I-trip Vmax Imax Pd typ Max. Time to trip R0 min R1max
Current Time
(A) (A) (Vdc) (A) (W) (A) (Sec.) (Ohm) (Ohm)
DT-0603-050L 0.50 1.00 9 50 0.50 8.00 0.60 0.090 0.250
DT-0603-050/12L 0.50 1.00 12 50 0.50 8.00 0.60 0.090 0.250
DT-0603-075L 0.75 1.50 9 50 0.50 8.00 1.00 0.070 0.220
DT-0603-075/12L 0.75 1.50 12 50 0.50 8.00 1.00 0.070 0.220
DT-0603-100L 1.00 2.00 9 50 0.50 8.00 2.00 0.040 0.150
DT-0603-100/12L 1.00 2.00 12 50 0.50 8.00 2.00 0.040 0.150
DT-0603-125L 1.25 2.50 9 50 0.50 8.00 3.00 0.030 0.120
DT-0603-125/12L 1.25 2.50 12 50 0.50 8.00 3.00 0.030 0.120
DT-0603-150L 1.50 3.00 9 50 0.50 8.00 4.00 0.020 0.080
DT-0603-150/12L 1.50 3.00 12 50 0.50 8.00 4.00 0.020 0.080
DT-0603-175L 1.75 3.50 9 50 0.50 8.00 5.00 0.015 0.070
DT-0603-175/12L 1.75 3.50 12 50 0.50 8.00 5.00 0.015 0.070
DT-0603-200L 2.00 4.00 9 50 0.50 8.00 5.00 0.012 0.065
DT-0603-200/12L 2.00 4.00 12 50 0.50 8.00 5.00 0.012 0.065
DT-0603-250L 2.50 5.00 9 50 0.50 8.00 5.00 0.010 0.060
DT-0603-250/12L 2.50 5.00 12 50 0.50 8.00 5.00 0.010 0.060
DT-0603-260L 2.60 5.20 9 50 0.50 8.00 5.00 0.008 0.055
DT-0603-260/12L 2.60 5.20 12 50 0.50 8.00 5.00 0.008 0.055
DT-0603-300L 3.00 6.00 9 50 0.50 8.00 5.00 0.008 0.050
DT-0603-300/12L 3.00 6.00 12 50 0.50 8.00 5.00 0.008 0.050

I-hold: Holding Current: maximum current at which the device will not trip in 25℃ still air.

I-trip: Tripping Current: minimum current at which the device will trip in 25℃ still air.

Vmax: Maximum voltage device can withstand without damage at rated current(Imax).

I max: Maximum fault current device can withstand without damage at rated voltage(Vmax).

Pd typ:Typical power dissipated from device when in the tripped state at 25℃ still air.

R0 min:Minimum resistance of device in initial (un-soldered) state.

R1 max:Maximum resistance of device at  25℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.

2、Product Dimensions(mm)&Marking  :

图片1.jpg

Model A B C D E Marking
Min Max Min Max Min Max Min Max Min
DT-0603-050L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 C
DT-0603-050/12L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 C
DT-0603-075L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 D
DT-0603-075/12L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 D
DT-0603-100L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 E
DT-0603-100/12L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 E
DT-0603-125L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 F
DT-0603-125/12L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 F
DT-0603-150L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 T
DT-0603-150/12L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 T
DT-0603-175L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 H
DT-0603-175/12L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 H
DT-0603-200L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 I
DT-0603-200/12L 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.50 0.05 I
DT-0603-250L 1.45 1.85 0.65 1.05 0.60 1.00 0.15 0.50 0.05 J
DT-0603-250/12L 1.45 1.85 0.65 1.05 0.60 1.00 0.15 0.50 0.05 J
DT-0603-260L 1.45 1.85 0.65 1.05 0.60 1.00 0.15 0.50 0.05 K
DT-0603-260/12L 1.45 1.85 0.65 1.05 0.60 1.00 0.15 0.50 0.05 K
DT-0603-300L 1.45 1.85 0.65 1.05 0.60 1.00 0.15 0.50 0.05 L
DT-0603-300/12L 1.45 1.85 0.65 1.05 0.60 1.00 0.15 0.50 0.05 L

3、Thermal Derating Chart:

Model Ambient Operating Temperature
-40℃ -20℃ 0℃ 25℃ 40℃ 50℃ 60℃ 70℃ 85℃
DT-0603-050L 0.73 0.66 0.57 0.50 0.44 0.38 0.35 0.30 0.24
DT-0603-050/12L 0.73 0.66 0.57 0.50 0.44 0.38 0.35 0.30 0.24
DT-0603-075L 1.10 0.99 0.86 0.75 0.66 0.58 0.52 0.45 0.36
DT-0603-075/12L 1.10 0.99 0.86 0.75 0.66 0.58 0.52 0.45 0.36
DT-0603-100L 1.46 1.32 1.14 1.00 0.87 0.77 0.70 0.61 0.48
DT-0603-100/12L 1.46 1.32 1.14 1.00 0.87 0.77 0.70 0.61 0.48
DT-0603-125L 1.83 1.65 1.43 1.25 1.09 0.96 0.87 0.76 0.60
DT-0603-125/12L 1.83 1.65 1.43 1.25 1.09 0.96 0.87 0.76 0.60
DT-0603-150L 2.19 1.98 1.72 1.50 1.31 1.15 1.05 0.91 0.71
DT-0603-150/12L 2.19 1.98 1.72 1.50 1.31 1.15 1.05 0.91 0.71
DT-0603-175L 2.56 2.31 2.00 1.75 1.53 1.34 1.22 1.06 0.83
DT-0603-175/12L 2.56 2.31 2.00 1.75 1.53 1.34 1.22 1.06 0.83
DT-0603-200L 2.92 2.64 2.29 2.00 1.75 1.54 1.39 1.21 0.95
DT-0603-200/12L 2.92 2.64 2.29 2.00 1.75 1.54 1.39 1.21 0.95
DT-0603-250L 3.65 3.30 2.86 2.50 2.18 1.92 1.74 1.51 1.19
DT-0603-250/12L 3.65 3.30 2.86 2.50 2.18 1.92 1.74 1.51 1.19
DT-0603-260L 3.80 3.43 2.98 2.60 2.27 2.00 1.81 1.57 1.24
DT-0603-260/12L 3.80 3.43 2.98 2.60 2.27 2.00 1.81 1.57 1.24
DT-0603-300L 4.38 3.96 3.43 3.00 2.62 2.31 2.09 1.82 1.43
DT-0603-300/12L 4.38 3.96 3.43 3.00 2.62 2.31 2.09 1.82 1.43 
4、Soldering parameters 

Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (Ts(max) to TP) 3°C/second max
Pre Heat: Temperature Min (Ts(min)) 150°C
Temperature Max (Ts(max)) 200°C
Time (Min to Max) (ts) 60 – 180 secs
Time Maintained Above: Temperature (TL) 217°C
Temperature (tL) 60 – 150 seconds
Peak / Classification Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.

◆All temperature refer to topside of thepackage, measured on the package body surface

◆If reflow temperature exceeds the recommended profile,devices may not meet the performance requirements

◆Recommended reflow methods: IR,vapor phase oven,hot air oven,,N2 environment for lead

◆Recommended maximum paste thickness is 0.25mm (0.010inch)

◆Devices can be cleaned using standard industry methods and solvents

5、Recommended Pad Layout(mm) & Physical Specifications 

Terminal Material Tin-Plated Nickle-Copper (Solder Material: Matte Tin (Sn))
Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-Std-002 Category 3.

6、Environmental Specifications 

Operating Temperature -40 °C to +85 °C
Maximum Device Surface Temperature in tripped State 125°C
Passive Aging +85 °C, 1000 hours ; ±10 % typical resistance change
Humidity Aging +85 °C, 85 % R.H. 100 hours; ±15 % typical resistance change
Thermal Shock MIL–Std–202, Method 107; +85 °C to -40 °C, 20 times;-30 % typical resistance change
Solvent Resistance MIL–Std–202, Method 215 ; No change
Vibration MIL–Std–883, Method 2007, Condition A; No change
Moisture Sensivity Level Level 2, J–Std–020
Storage Conditions +30 °C Max. 60% RH Max. Packed in original packaging.

7、Test Procedures And Requirements 

No. Test Test Conditions Accept/Reject Criteria
1 R0 min Resistance measurement at 25℃ R0min ≤ R ≤ R1max
2 R1 max Resistance measurement one hour after post trip R0min ≤ R ≤ R1max
3 I-hold Hold rated current 1800 second without trip, @ 25℃ No trip
4 I-trip Device must trip within 900 second under rated current, @25℃ trip
5 Max. time to trip At specified current,  25 °C  T ≤ max. time to trip (seconds)
6 trip Cycle Life Vmax, Imax, 100 cycles No arcing or burning
7 trip Endurance Vmax,Imax 24 hours No arcing or burning
8 Solderability ANSI/J-Std-002 95 % min. coverage

8、Tape and Reel Specifications&Packaging quantity per Reel 

Item DT-0603-050L  DT-0603-050/12L DT-0603-075L  DT-0603-075/12L DT-0603-100L  DT-0603-100/12L DT-0603-125L  DT-0603-125/12L DT-0603-150L  DT-0603-150/12L DT-0603-175L  DT-0603-175/12L DT-0603-200L  DT-0603-200/12L DT-0603-250L  DT-0603-250/12L DT-0603-260L  DT-0603-260/12L DT-0603-300L  DT-0603-300/12L    
W 8.00±0.30 8.00±0.30
F 3.50±0.10 3.50±0.10
E1 1.75±0.10 1.75±0.10
D0 1.55±0.05 1.55±0.05
D1 0.50±0.10 0.50±0.10
P0 4.00±0.10 4.00±0.10
P1 4.00±0.10 4.00±0.10
P2 2.00±0.05 2.00±0.05
A0 1.10±0.10 1.10±0.10
B0 1.85±0.10 1.90±0.10
T 0.20±0.10 0.20±0.10
K0 0.72±0.10 0.85±0.10
Leader min 390mm 390mm
trailer min 160mm 160mm
Q'ty 5,000pcs/Reel 4,000pcs/Reel
REEL DIMENSIONS: EIA-481-1 (mm)
C Ø178±1.0
D Ø60.2±0.5
W 9.0±1.5
H 11.0±0.5

9、Part Ordering Number System 

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